A thermal insulation stamper includes a first metal layer, a heat insulating layer, an intermediate layer, a conductive coating, and a second metal layer. The first metal layer has a fine pattern on an exposed surface. The heat insulating layer is formed of a heat-resistant resin and overlies the first metal layer. The heat-resistant resin contains oxygen. The intermediate layer overlies the heat insulating layer. The conductive coating overlies the intermediate metal layer. The second metal layer overlies the conductive coating. A region with a high concentration of oxygen is formed in the vicinity of an interface between the heat insulating layer and the intermediate layer. A method for producing such a thermal insulation stamper is also disclosed.