Invention Grant
- Patent Title: Method of fabricating semiconductor device
- Patent Title (中): 制造半导体器件的方法
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Application No.: US12659601Application Date: 2010-03-15
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Publication No.: US08071415B2Publication Date: 2011-12-06
- Inventor: Tomohiro Okamura , Masao Okihara
- Applicant: Tomohiro Okamura , Masao Okihara
- Applicant Address: JP
- Assignee: Lapis Semiconductor Co., Ltd.
- Current Assignee: Lapis Semiconductor Co., Ltd.
- Current Assignee Address: JP
- Agency: Rabin & Berdo, PC
- Priority: JP2009-080534 20090327
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
There is provided a method of fabricating a semiconductor device having plural light receiving elements, and having an amplifying element, the method including: a) forming an active region on the semiconductor substrate for configuring the amplifying element; b) forming a light receiving element region on the semiconductor substrate for forming the plural light receiving elements, with the active region acting as a reference for positioning; c) implanting an impurity into the light receiving element region; d) repeating the process b) and the process c) a number of times that equals a number of diffusion layers in the light receiving element region; e) after implanting the impurity, performing a drive-in process to carry out drive in of the semiconductor substrate; and f) the process e), forming an amplifying element forming process by implanting an impurity in the active region.
Public/Granted literature
- US20100248410A1 Method of fabricating semiconductor device Public/Granted day:2010-09-30
Information query
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