发明授权
- 专利标题: Light emitting element module and method for sealing light emitting element
- 专利标题(中): 发光元件模块及密封发光元件的方法
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申请号: US11996724申请日: 2006-03-09
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公开(公告)号: US08072139B2公开(公告)日: 2011-12-06
- 发明人: Kouki Hatsuda , Hiroshi Samukawa
- 申请人: Kouki Hatsuda , Hiroshi Samukawa
- 申请人地址: JP Tokyo JP Tokyo
- 专利权人: Sony Corporation,Sony Chemical & Information Device
- 当前专利权人: Sony Corporation,Sony Chemical & Information Device
- 当前专利权人地址: JP Tokyo JP Tokyo
- 代理机构: K&L Gates LLP
- 优先权: JP2005-214842 20050725
- 国际申请: PCT/JP2006/304589 WO 20060309
- 国际公布: WO2007/013200 WO 20070201
- 主分类号: H05B33/00
- IPC分类号: H05B33/00 ; H05B33/04 ; H05B33/10
摘要:
Disclosed is a method for sealing a light-emitting device wherein formation of air bubbles in a light-emitting device module can be prevented by performing no gelation after fitting of a cover member. This method also enables to seal a light-emitting device by using a gel sealing material composed of a gel precursor which uses a solvent. Also disclosed is a light-emitting module formed by such a sealing method. In this method for sealing a light-emitting device, gelation of the gel precursor of a gel sealing material is performed before placing the precursor on the light-emitting device, and thus no gelation is necessary after fitting of a cover member. Consequently, a gel precursor having high viscosity that is difficult to be used in an injection method can be used in this method. Furthermore, a substance which requires use of a solvent can be used as a gel precursor of a gel sealing material. A light-emitting device module with high luminance wherein no air bubbles are included can be obtained by this method.
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