发明授权
- 专利标题： Capacitor and wiring board including the capacitor
- 专利标题（中）： 电容器和电路板包括电容器
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申请号： US12100527申请日： 2008-04-10
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公开(公告)号： US08072732B2公开(公告)日： 2011-12-06
- 发明人: Motohiko Sato , Kenji Murakami , Jun Otsuka , Manabu Sato , Masahiko Okuyama , Kozo Yamazaki
- 申请人： Motohiko Sato , Kenji Murakami , Jun Otsuka , Manabu Sato , Masahiko Okuyama , Kozo Yamazaki
- 申请人地址： JP Nagoya
- 专利权人： NGK Spark Plug Co., Ltd.
- 当前专利权人： NGK Spark Plug Co., Ltd.
- 当前专利权人地址： JP Nagoya
- 代理机构： Stites & Harbison, PLLC
- 代理商 Jeffrey A. Haeberlin
- 优先权： JP2007-102471 20070410; JP2008-008715 20080118
- 主分类号： H01G4/005
- IPC分类号： H01G4/005
摘要：
A capacitor is provided having a tough surface portion which prevents cracking that tends to occur when the capacitor is built-in or surface-mounted on a wiring board. A ceramic sintered body of the capacitor includes a capacitor forming layer portion, a cover layer portion and an interlayer portion. The capacitor forming layer portion has a laminated structure wherein ceramic dielectric layers and inner electrodes connected to a peripheral portion of capacitor via conductors, are alternately laminated. The cover layer portion is exposed at a surface portion of the ceramic body and has a laminated structure wherein ceramic dielectric layers and dummy electrodes not connected to the capacitor via conductors, are alternately laminated.
公开/授权文献
- US20080251285A1 CAPACITOR AND WIRING BOARD INCLUDING THE CAPACITOR 公开/授权日：2008-10-16
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