Invention Grant
- Patent Title: Vertical curve system for surface grading
- Patent Title (中): 用于表面分级的垂直曲线系统
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Application No.: US12148310Application Date: 2008-04-18
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Publication No.: US08073791B2Publication Date: 2011-12-06
- Inventor: Mark Williams , Alan Williams
- Applicant: Mark Williams , Alan Williams
- Agent Ian C. McLeod
- Main IPC: G06F15/18
- IPC: G06F15/18 ; G06N3/00 ; G06N3/12 ; G01V3/00 ; G01V7/00

Abstract:
A method is disclosed that generates design profiles and a surface therefrom that promote water drainage from soil in an area of interest. Topographical data describing an initial surface of the area of interest are used to form initial profiles. The method generates the design profiles using the initial profiles and desired design parameters such as minimum slope, maximum slope, optimal slope, maximum depth, optimal depth, starting elevation, ending elevation, rules of curvature, and rules of earth balancing. The method generates design surface profiles so that the cut volumes and fill volumes of the soil are at or near balance as much as possible from the available soil in the area of interest.
Public/Granted literature
- US20080262988A1 Vertical curve system for surface grading Public/Granted day:2008-10-23
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