发明授权
- 专利标题: Method of making sub-resolution pillar structures using undercutting technique
- 专利标题(中): 使用底切技术制作分辨率柱状结构的方法
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申请号: US12285466申请日: 2008-10-06
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公开(公告)号: US08076056B2公开(公告)日: 2011-12-13
- 发明人: Chun-Ming Wang , Steven Maxwell , Paul Wai Kie Poon , Yung-Tin Chen
- 申请人: Chun-Ming Wang , Steven Maxwell , Paul Wai Kie Poon , Yung-Tin Chen
- 申请人地址: US CA Milpitas
- 专利权人: SanDisk 3D LLC
- 当前专利权人: SanDisk 3D LLC
- 当前专利权人地址: US CA Milpitas
- 代理机构: The Marbury Law Group, PLLC
- 主分类号: G03F7/26
- IPC分类号: G03F7/26
摘要:
A method of making a device includes forming an underlying mask layer over an underlying layer, forming a first mask layer over the underlying mask layer, patterning the first mask layer to form first mask features, undercutting the underlying mask layer to form underlying mask features using the first mask features as a mask, removing the first mask features, and patterning the underlying layer using at least the underlying mask features as a mask.
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