发明授权
- 专利标题： Temperature computing instrument and method for calibrating temperature of sensor part used therefor
- 专利标题（中）： 用于校准传感器部件温度的温度计算仪器和方法
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申请号： US12257703申请日： 2008-10-24
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公开(公告)号： US08079758B2公开(公告)日： 2011-12-20
- 发明人: Kenji Kamei , Seiji Tsutsui
- 申请人： Kenji Kamei , Seiji Tsutsui
- 申请人地址： JP
- 专利权人： Sebacs Co., Ltd.
- 当前专利权人： Sebacs Co., Ltd.
- 当前专利权人地址： JP
- 代理机构： Ostrolenk Faber LLP
- 优先权： JP2007-277052 20071025; JP2008-258337 20081003
- 主分类号： G01K7/00
- IPC分类号： G01K7/00 ; G01K15/00
摘要：
A sensor part is provided with a printed circuit board that is made of resin and formed with a pair of electrically conductive metal patterns. Each of the pair of electrically conductive metal patterns includes: a first pattern part connected to a pair of electrodes of a temperature sensor; a second pattern part connected to a pair of conductive wires; and a connection part making a connection between the first and second pattern parts. The connection between the pair of electrodes of the temperature sensor and the first pattern part or between the pair of conductive wires and the second pattern part is made with the use of Dotite or solder.