Invention Grant
US08079894B2 Chemical mechanical polishing system having multiple polishing stations and providing relative linear polishing motion 有权
化学机械抛光系统具有多个抛光台并提供相对的线性抛光运动

Chemical mechanical polishing system having multiple polishing stations and providing relative linear polishing motion
Abstract:
A chemical-mechanical polishing apparatus including a table top, a transfer station mounted on the table top, a plurality of polishing stations mounted on the table top, a plurality of washing stations, and a plurality of carrier heads supported by a support member rotatable about an axis. Each washing station is located between a first polishing station and either a second polishing station or the transfer station, and the transfer station and the plurality of polishing stations are arranged at approximately equal angular intervals about the axis.
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