发明授权
- 专利标题： Integrated circuit packaging system with interposer interconnections and method of manufacture thereof
- 专利标题（中）： 具有插入器互连的集成电路封装系统及其制造方法
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申请号： US12473253申请日： 2009-05-27
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公开(公告)号： US08080446B2公开(公告)日： 2011-12-20
- 发明人: A Leam Choi , Kenny Lee , In Sang Yoon , HanGil Shin
- 申请人： A Leam Choi , Kenny Lee , In Sang Yoon , HanGil Shin
- 申请人地址： SG Singapore
- 专利权人： STATS ChipPAC Ltd.
- 当前专利权人： STATS ChipPAC Ltd.
- 当前专利权人地址： SG Singapore
- 代理商 Mikio Ishimaru
- 主分类号： H01L23/31
- IPC分类号： H01L23/31
摘要：
A method of manufacture of an integrated circuit packaging system includes: providing an integrated circuit; mounting a routing structure having a functional side above the integrated circuit; mounting a vertical interconnect to the functional side of the routing structure and the vertical interconnect extending vertically away from the routing structure; and forming an encapsulation that encapsulates the integrated circuit, the routing structure.