发明授权
US08080447B2 Method of manufacturing semiconductor device including exposing a dicing line on a wafer
有权
制造半导体器件的方法，包括将切割线暴露在晶片上
- 专利标题： Method of manufacturing semiconductor device including exposing a dicing line on a wafer
- 专利标题（中）： 制造半导体器件的方法，包括将切割线暴露在晶片上
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申请号： US12842080申请日： 2010-07-23
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公开(公告)号： US08080447B2公开(公告)日： 2011-12-20
- 发明人: Nobuaki Hashimoto
- 申请人： Nobuaki Hashimoto
- 申请人地址： JP
- 专利权人： Seiko Epson Corporation
- 当前专利权人： Seiko Epson Corporation
- 当前专利权人地址： JP
- 代理机构： Harness, Dickey & Pierce, P.L.C.
- 优先权： JP2004-268116 20040915; JP2005-088713 20050325; JP2005-210056 20050720
- 主分类号： H01L21/82
- IPC分类号： H01L21/82
摘要：
A method of manufacturing a semiconductor device, including the following steps, forming a resin layer on a surface of a semiconductor chip, the surface is provided with a bump formed thereon, the resin layer having photosensitivity and adhesiveness, exposing an upper surface of the bump by removing a part of the resin layer right above the bump by exposing and then developing the resin layer, and bonding the semiconductor chip provided with a resin film formed of the resin layer face-down to a substrate, the bump of the semiconductor chip and a conductive section of the substrate being electrically connected by the resin film functioning as an adhesive.
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