发明授权
- 专利标题： Top contact LED thermal management
- 专利标题（中）： 热门联系LED热管理
-
申请号： US12183772申请日： 2008-07-31
-
公开(公告)号： US08080827B2公开(公告)日： 2011-12-20
- 发明人: Wei Shi
- 申请人： Wei Shi
- 申请人地址： US CA Livermore
- 专利权人： Bridgelux, Inc.
- 当前专利权人： Bridgelux, Inc.
- 当前专利权人地址： US CA Livermore
- 代理机构： Haynes and Boone, LLP
- 主分类号： H01L33/48
- IPC分类号： H01L33/48 ; H01L31/12 ; H01L27/15
摘要：
An LED having enhanced heat dissipation is disclosed. For example, an LED die can have extended bond pads that are configured to enhance heat flow from an active region of the LED to a lead frame. A heat transmissive substrate can further enhance heat flow away from the LED die. By enhancing heat dissipation, more current can be used to drive the LED. The use of more current facilitates the production of brighter LEDs.
公开/授权文献
- US20100025718A1 Top contact LED thermal management 公开/授权日：2010-02-04
信息查询
IPC分类:
