Invention Grant
- Patent Title: Composition for removing photoresist and method of manufacturing an array substrate using the same
- Patent Title (中): 用于除去光致抗蚀剂的组合物及其制造方法
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Application No.: US12323649Application Date: 2008-11-26
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Publication No.: US08084184B2Publication Date: 2011-12-27
- Inventor: Jong-Hyun Choung , Hong-Sick Park , Sun-Young Hong , Bong-Kyun Kim , Byeoung-Jin Lee , Byung-Uk Kim , Jong-Hyun Jeong , Suk-Il Yoon , Sung-Gun Shin , Soon-Beom Huh , Se-Hwan Jung , Doo-Young Jang
- Applicant: Jong-Hyun Choung , Hong-Sick Park , Sun-Young Hong , Bong-Kyun Kim , Byeoung-Jin Lee , Byung-Uk Kim , Jong-Hyun Jeong , Suk-Il Yoon , Sung-Gun Shin , Soon-Beom Huh , Se-Hwan Jung , Doo-Young Jang
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Cantor Colburn LLP
- Priority: KR10-2007-0140687 20071228
- Main IPC: G03F7/00
- IPC: G03F7/00 ; G03F7/26 ; G03F7/32 ; G03F7/40
Abstract:
A composition for removing a photoresist includes a) an amine compound having a cyclic amine and/or a diamine, b) a glycol ether compound, c) a corrosion inhibitor and d) a polar solvent. The composition further includes a stripping promoter. Further disclosed is a method of manufacturing an array substrate using the composition for removing a photoresist.
Public/Granted literature
- US20090170037A1 COMPOSITION FOR REMOVING PHOTORESIST AND METHOD OF MANUFACTURING AN ARRAY SUBSTRATE USING THE SAME Public/Granted day:2009-07-02
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