Invention Grant
- Patent Title: Reducing noise coupling in high speed digital systems
- Patent Title (中): 降低高速数字系统中的噪声耦合
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Application No.: US11924416Application Date: 2007-10-25
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Publication No.: US08084692B2Publication Date: 2011-12-27
- Inventor: Moises Cases , Bradley D. Herrman , Kent B. Howieson , Erdem Matoglu , Bhyrav M. Mutnury , Pravin S. Patel , Nam H. Pham , Caleb J. Wesley
- Applicant: Moises Cases , Bradley D. Herrman , Kent B. Howieson , Erdem Matoglu , Bhyrav M. Mutnury , Pravin S. Patel , Nam H. Pham , Caleb J. Wesley
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Cantor Colburn LLP
- Agent Cynthia Seal
- Main IPC: H05K1/03
- IPC: H05K1/03

Abstract:
An apparatus having reduced noise coupling includes a core layer having an upper and lower surface, the upper and lower surface each including a copper sheet layer, a pre-preg layer having an upper surface and a lower surface, the upper surface of the pre-preg layer coupled to the lower surface of the core layer, a core insulating layer having an upper surface and a lower surface, the upper surface of the core insulating layer coupled to the lower surface of the pre-preg layer, a return current reference layer disposed on the lower surface of the core insulator layer and high-speed signal traces disposed on the upper surface of the core insulating layer, each of the high speed signal traces disposed on a pedestal defined by a section of the pre-preg layer and the core insulating layer, each pedestal being separated by an air gap disposed between adjacent pedestals.
Public/Granted literature
- US20090107705A1 METHODS AND SYSTEMS FOR REDUCING NOISE COUPLING IN HIGH SPEED DIGITAL SYSTEMS Public/Granted day:2009-04-30
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