发明授权
US08084846B2 Balanced semiconductor device packages including lead frame with floating leads and associated methods
有权
平衡的半导体器件封装，包括带引线的引线框架和相关方法
- 专利标题： Balanced semiconductor device packages including lead frame with floating leads and associated methods
- 专利标题（中）： 平衡的半导体器件封装，包括带引线的引线框架和相关方法
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申请号： US11606497申请日： 2006-11-29
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公开(公告)号： US08084846B2公开(公告)日： 2011-12-27
- 发明人: Teck Kheng Lee , Kian Chai Lee , Vanessa Chong Hui Van
- 申请人： Teck Kheng Lee , Kian Chai Lee , Vanessa Chong Hui Van
- 申请人地址： US ID Boise
- 专利权人： Micron Technology, Inc.
- 当前专利权人： Micron Technology, Inc.
- 当前专利权人地址： US ID Boise
- 代理机构： TraskBritt
- 主分类号： H01L23/34
- IPC分类号： H01L23/34
摘要：
A semiconductor device assembly or package includes at least one semiconductor device that is positioned adjacent to floating leads. Such an assembly or package may include at least two semiconductor devices that face opposite directions from one another, with each being oriented such that bond pads thereof are at an opposite side of the assembly or package from bond pads of the other. Alternatively, an assembly or package may include a lead assembly with an internal portion, including one or more floating leads, and an external portion that are in planes that are offset relative to one another. Methods for designing lead frames, assemblies, and packages are also disclosed, as are assembly and packaging methods.
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