Invention Grant
- Patent Title: Electronic component and manufacturing the same
- Patent Title (中): 电子元件与制造相同
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Application No.: US12050814Application Date: 2008-03-18
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Publication No.: US08085551B2Publication Date: 2011-12-27
- Inventor: Seiji Karasawa , Koji Fujimoto
- Applicant: Seiji Karasawa , Koji Fujimoto
- Applicant Address: JP
- Assignee: KOA Corporation
- Current Assignee: KOA Corporation
- Current Assignee Address: JP
- Agent Stephen Chin
- Priority: JP2007-070672 20070319
- Main IPC: H05K7/00
- IPC: H05K7/00 ; H05K3/30

Abstract:
The present invention is to provide an electronic component where positional accuracy for arranging members constituting a circuit element such as a resistor element and the like is mitigated and corrosion of a terminal electrode caused by sulfur in the atmosphere is reduced. The four chips connected resistor device 1 as an electronic component comprises: an insulating substrate 2 including a front surface 2a, a back surface 2b and a side surface 2c connecting the front surface 2a with the back surface 2b; a pair of terminal electrodes placed on the front and back surfaces 2a and 2b and the side surface 2c; a resistor element 5 including a resistor member 4 connected to the pair of terminal electrodes, and a protective layer (a glass film 6 and an overcoating film 7) for protecting the resistor member 4: the auxiliary electrode 9 placed with covering the interface 8 between the overcoating film 7 and the terminal electrode 3; and a nickel plated layer 10 and a solder plated layer 11 placed on the surfaces of the terminal electrode 3 and the auxiliary electrode 9. The interface 8 is placed at the end portion 2c of the insulating substrate 2.
Public/Granted literature
- US20080232075A1 Electronic Component and Manufacturing the Same Public/Granted day:2008-09-25
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