Invention Grant
- Patent Title: 3D smart power module
- Patent Title (中): 3D智能电源模块
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Application No.: US12886614Application Date: 2010-09-21
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Publication No.: US08088645B2Publication Date: 2012-01-03
- Inventor: Yong Liu , Yumin Liu , Hua Yang , Tiburcio A. Maldo , Margie T. Rios
- Applicant: Yong Liu , Yumin Liu , Hua Yang , Tiburcio A. Maldo , Margie T. Rios
- Applicant Address: US ME South Portland
- Assignee: Fairchild Semiconductor Corporation
- Current Assignee: Fairchild Semiconductor Corporation
- Current Assignee Address: US ME South Portland
- Agency: Hiscock & Barclay, LLP
- Agent Thomas R. FitzGerald, Esq.
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L21/48
Abstract:
A 3D smart power module for power control, such as a three phase power control module, includes a two sided printed circuit (PC) board with power semiconductor devices attached to one side and control semiconductor devices attached to the other side. The power semiconductor devices are die bonded to a direct bonded copper substrate which has a bottom surface exposed in the molded package. In one embodiment the module has 27 external connectors attached to one side of the PC board and arranged in the form of a ball grid array.
Public/Granted literature
- US20110070699A1 3D SMART POWER MODULE Public/Granted day:2011-03-24
Information query
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