发明授权
US08088682B2 Method for fabricating integrated circuit with gate electrode level region including two side-by-side ones of at least three linear-shaped conductive structures electrically connected to each other through non-gate level 有权
用于制造集成电路的方法,该栅极电极电平区域包括至少三个线性导电结构的两个并排电极,其通过非栅极电平彼此电连接

  • 专利标题: Method for fabricating integrated circuit with gate electrode level region including two side-by-side ones of at least three linear-shaped conductive structures electrically connected to each other through non-gate level
  • 专利标题(中): 用于制造集成电路的方法,该栅极电极电平区域包括至少三个线性导电结构的两个并排电极,其通过非栅极电平彼此电连接
  • 申请号: US12572232
    申请日: 2009-10-01
  • 公开(公告)号: US08088682B2
    公开(公告)日: 2012-01-03
  • 发明人: Scott T. BeckerMichael C. Smayling
  • 申请人: Scott T. BeckerMichael C. Smayling
  • 申请人地址: US CA Los Gatos
  • 专利权人: Tela Innovations, Inc.
  • 当前专利权人: Tela Innovations, Inc.
  • 当前专利权人地址: US CA Los Gatos
  • 代理机构: Martine Penilla Group, LLP
  • 主分类号: H01L21/3205
  • IPC分类号: H01L21/3205
Method for fabricating integrated circuit with gate electrode level region including two side-by-side ones of at least three linear-shaped conductive structures electrically connected to each other through non-gate level
摘要:
A cell of a semiconductor device includes a diffusion level including a plurality of diffusion regions separated by inactive regions. The cell includes a gate electrode level including conductive features defined to extend in only a first parallel direction. Adjacent conductive features that share a common line of extent in the first parallel direction are fabricated from respective originating layout features that are separated from each other by an end-to-end spacing having a size that is substantially equal and minimized across the gate electrode level region. Some of the conductive features form respective PMOS and/or NMOS transistor devices. A number of the PMOS transistor devices is equal to a number of the NMOS transistor devices in the cell. A width of the conductive features within a five wavelength photolithographic interaction radius is less than a wavelength of light of 193 nanometers as used in a photolithography process for their fabrication.
信息查询
IPC分类:
H 电学
H01 基本电气元件
H01L 半导体器件;其他类目中不包括的电固体器件(使用半导体器件的测量入G01;一般电阻器入H01C;磁体、电感器、变压器入H01F;一般电容器入H01G;电解型器件入H01G9/00;电池组、蓄电池入H01M;波导管、谐振器或波导型线路入H01P;线路连接器、汇流器入H01R;受激发射器件入H01S;机电谐振器入H03H;扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R;一般电光源入H05B;印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K;在具有特殊应用的电路中使用的半导体器件见应用相关的小类)
H01L21/00 专门适用于制造或处理半导体或固体器件或其部件的方法或设备
H01L21/02 .半导体器件或其部件的制造或处理
H01L21/04 ..至少具有一个跃变势垒或表面势垒的器件,例如PN结、耗尽层、载体集结层
H01L21/18 ...器件有由周期表Ⅳ族元素或含有/不含有杂质的AⅢBⅤ族化合物构成的半导体,如掺杂材料
H01L21/30 ....用H01L21/20至H01L21/26各组不包含的方法或设备处理半导体材料的(在半导体材料上制作电极的入H01L21/28)
H01L21/31 .....在半导体材料上形成绝缘层的,例如用于掩膜的或应用光刻技术的(密封层入H01L21/56);以及这些层的后处理;这些层的材料的选择
H01L21/3205 ......非绝缘层的沉积,例如绝缘层上的导电层或电阻层;这些层的后处理(电极的制造入H01L21/28)
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