发明授权
- 专利标题： Bonded body, bonding material composition, honeycomb segment bonded body, and honeycomb structure using the same
- 专利标题（中）： 接合体，接合材料组成，蜂窝体结合体和使用其的蜂窝结构体
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申请号： US12235379申请日： 2008-09-22
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公开(公告)号： US08088702B2公开(公告)日： 2012-01-03
- 发明人: Takahiro Tomita , Kenji Morimoto
- 申请人： Takahiro Tomita , Kenji Morimoto
- 申请人地址： JP Nagoya
- 专利权人： NGK Insulators, Ltd.
- 当前专利权人： NGK Insulators, Ltd.
- 当前专利权人地址： JP Nagoya
- 代理机构： Oliff & Berridge, PLC
- 优先权： JP2006-082103 20060324
- 主分类号： C04B38/00
- IPC分类号： C04B38/00 ; B32B3/12 ; B01D39/06
摘要：
There is provided a bonding material composition capable of suppressing crack generation on an end face of a resultant honeycomb structure to a large extent by reducing anisotropy of Young's modulus after curing of the bonding material by the use of an isotropic filler without using inorganic fibers. The bonded body has two or more members unitarily bonded by means of a bonding material layer, and the relational expression of 0.5
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