发明授权
US08089140B2 Lead frame assembly, lead frame and insulating housing combination, and led module having the same
有权
引线框架组合，引线框架和绝缘外壳组合，以及具有相同功能的LED模块
- 专利标题： Lead frame assembly, lead frame and insulating housing combination, and led module having the same
- 专利标题（中）： 引线框架组合，引线框架和绝缘外壳组合，以及具有相同功能的LED模块
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申请号： US12585715申请日： 2009-09-23
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公开(公告)号： US08089140B2公开(公告)日： 2012-01-03
- 发明人: Shih-Chung Huang , Chen-Hsiu Lin , Meng-Sung Chou
- 申请人： Shih-Chung Huang , Chen-Hsiu Lin , Meng-Sung Chou
- 申请人地址： CN Guangzhou TW Taipei
- 专利权人： Silitek Electronic (Guangzhou) Co., Ltd.,Lite-On Technology Corp.
- 当前专利权人： Silitek Electronic (Guangzhou) Co., Ltd.,Lite-On Technology Corp.
- 当前专利权人地址： CN Guangzhou TW Taipei
- 代理机构： Rosenberg, Klein & Lee
- 优先权： CN200810198897 20080925; CN200910037696 20090305
- 主分类号： H01L23/495
- IPC分类号： H01L23/495
摘要：
A unitary lead frame assembly having a plurality of lead frame sets each comprises a first lead frame unit. The first lead frame unit has a pair of first and second frame portions extending along a first direction and spaced apart from each other along a second direction different from the first direction. The lead frame set further comprises at least two second lead frame units disposed between the first and second frame portions and spaced apart from each other along the second direction. Each of the second lead frame units cooperates with the first lead frame unit to define at least one first die-bonding area therebetween.