发明授权
US08089774B2 Printed circuit board and semiconductor memory module using the same
有权
印刷电路板和使用其的半导体存储模块
- 专利标题： Printed circuit board and semiconductor memory module using the same
- 专利标题（中）： 印刷电路板和使用其的半导体存储模块
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申请号： US12000930申请日： 2007-12-19
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公开(公告)号： US08089774B2公开(公告)日： 2012-01-03
- 发明人: Hyun-Seok Choi , Yong-Hyun Kim , Jung-Chan Cho , Hyung-Mo Hwang
- 申请人： Hyun-Seok Choi , Yong-Hyun Kim , Jung-Chan Cho , Hyung-Mo Hwang
- 申请人地址： KR Gyeonggi-do
- 专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人地址： KR Gyeonggi-do
- 代理机构： Harness, Dickey & Pierce, P.L.C.
- 优先权： KR10-2006-0131083 20061220
- 主分类号： H05K7/02
- IPC分类号： H05K7/02 ; H05K7/06 ; H05K7/08 ; H05K7/10
摘要：
A semiconductor memory module includes a printed circuit board (PCB) including a rigid PCB part and a flexible PCB part including an overlap portion, a non-overlap portion, and memory components mounted on the PCB. The rigid PCB part includes a first surface and a second surface facing the first surface. The overlap portion of the flexible PCB part overlaps the rigid PCB part, and the non-overlap portion does not overlap the rigid PCB part. The flexible PCB part may include an overlap stacked structure including at least one doubling portion.
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