发明授权
- 专利标题: Method for manufacturing a substrate for a liquid ejection element
- 专利标题(中): 液体喷射元件用基板的制造方法
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申请号: US12434278申请日: 2009-05-01
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公开(公告)号: US08091235B2公开(公告)日: 2012-01-10
- 发明人: Hirokazu Komuro
- 申请人: Hirokazu Komuro
- 申请人地址: JP Tokyo
- 专利权人: Canon Kabushiki Kaisha
- 当前专利权人: Canon Kabushiki Kaisha
- 当前专利权人地址: JP Tokyo
- 代理机构: Fitzpatrick, Cella, Harper & Scinto
- 优先权: JP2004/210141 20040716
- 主分类号: B21D53/76
- IPC分类号: B21D53/76 ; G01D15/00 ; B41J2/045
摘要:
A manufacturing method for manufacturing a liquid ejection element including a liquid flow path which is open at an ejection outlet for ejecting liquid, and an energy generating member for generating energy usable for ejecting the liquid from liquid flow path through the ejection outlet, the manufacturing method, includes a step of forming the energy generating member on a front side of a substrate; a step of forming a top plate member on the side having the energy generating member formed by the energy generating member forming step, wherein the top plate member is a member in which the liquid flow path and the ejection outlet are formed; and a step of thinning the substrate, having the top plate member formed thereon by the top plate member forming step, from a back side thereof.
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