发明授权
- 专利标题： Process of forming an electronic device including a plurality of singulated die
- 专利标题（中）： 形成包括多个单模模具的电子装置的工艺
-
申请号： US11770295申请日： 2007-06-28
-
公开(公告)号： US08093102B2公开(公告)日： 2012-01-10
- 发明人: Ajay Somani
- 申请人： Ajay Somani
- 申请人地址： US TX Austin
- 专利权人： Freescale Semiconductor, Inc.
- 当前专利权人： Freescale Semiconductor, Inc.
- 当前专利权人地址： US TX Austin
- 主分类号： H01L21/00
- IPC分类号： H01L21/00
摘要：
An electronic device can include a first die having a first terminal at a first front side, and a second die having a second terminal at a second front side and a through via. In one aspect, a process of forming the electronic device includes supplying a second substrate including a die location of the second die. The process can also include attaching the second substrate to a handling substrate and singulating the second die from the second substrate before removing the handling substrate. In another aspect, the handling substrate can include a rigid substrate. The process can include orienting the front side of the first die and a back side of the second substrate front-to-back with respect to each other. In yet another aspect, the first terminal is electrically connected to the through via and the second terminal. In one embodiment, the electronic device can include a third die.
公开/授权文献
信息查询
IPC分类:
