A printed wiring board including a first insulating layer, a second insulating layer formed over the first insulating layer, a capacitor portion including an upper electrode, a lower electrode and a ceramic high dielectric layer formed between the upper electrode and the lower electrode, the capacitor portion sandwiched by the first insulating layer and the second insulating layer, an upper electrode connecting portion passing through the capacitor portion without contact and through the second insulating layer and electrically connected to the upper electrode of the capacitor portion, and a lower electrode connecting portion passing through the second insulating layer and the upper electrode of the capacitor portion without contact and electrically connected to the lower electrode in contact.