发明授权
US08093617B2 Bare microelectronic chip provided with a recess forming a housing for a wire element constituting a flexible mechanical support, fabrication process and microstructure
有权
裸露的微电子芯片设置有形成用于构成柔性机械支撑件，制造工艺和微结构的线元件的壳体的凹部
- 专利标题： Bare microelectronic chip provided with a recess forming a housing for a wire element constituting a flexible mechanical support, fabrication process and microstructure
- 专利标题（中）： 裸露的微电子芯片设置有形成用于构成柔性机械支撑件，制造工艺和微结构的线元件的壳体的凹部
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申请号： US12310246申请日： 2007-06-21
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公开(公告)号： US08093617B2公开(公告)日： 2012-01-10
- 发明人: Dominique Vicard , Bruno Mourey , Jean Brun
- 申请人： Dominique Vicard , Bruno Mourey , Jean Brun
- 申请人地址： FR Paris
- 专利权人： Commissariat à l'Energie Atomique
- 当前专利权人： Commissariat à l'Energie Atomique
- 当前专利权人地址： FR Paris
- 代理机构： Oliff & Berridge, PLC
- 优先权： FR0607588 20060829
- 国际申请： PCT/FR2007/001034 WO 20070621
- 国际公布： WO2008/025889 WO 20080306
- 主分类号： H01L33/00
- IPC分类号： H01L33/00
摘要：
A microelectronic chip comprises two parallel main faces and side faces. At least one of the faces comprises a recess provided with at least one electrical connection element and forming a housing for a wire element. The wire element simultaneously constitutes both an electrical connection between the chip and the outside via said connection element and a flexible mechanical support for said chip.
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