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US08093703B2 Semiconductor package having buried post in encapsulant and method of manufacturing the same 有权
具有埋置在密封剂中的半导体封装及其制造方法

Semiconductor package having buried post in encapsulant and method of manufacturing the same
Abstract:
In one embodiment, a semiconductor package includes a first insulating body and a first semiconductor chip having a first active surface and a first back surface opposite the first active surface. The first semiconductor chip is disposed within the first insulating body. The first active surface is exposed by the first insulating body. The first back surface is substantially surrounded by the first insulating body. The semiconductor package includes a post within the first insulating body and adjacent to a side of the first semiconductor chip.
Abstract(Chinese):

在一个实施例中，半导体封装包括第一绝缘体和具有第一有源表面和与第一有源表面相对的第一后表面的第一半导体芯片。 第一半导体芯片设置在第一绝缘体内。 第一活性表面被第一绝缘体暴露。 第一后表面基本上被第一绝缘体包围。 半导体封装包括在第一绝缘体内并邻近第一半导体芯片的一侧的柱。

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