Invention Grant
- Patent Title: E-beam defect review system
- Patent Title (中): 电子束缺陷检查系统
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Application No.: US12335458Application Date: 2008-12-15
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Publication No.: US08094924B2Publication Date: 2012-01-10
- Inventor: Jack Jau , Zhongwei Chen , Yi Xiang Wang , Chung-Shih Pan , Joe Wang , Xuedong Liu , Weiming Ren , Wei Fang
- Applicant: Jack Jau , Zhongwei Chen , Yi Xiang Wang , Chung-Shih Pan , Joe Wang , Xuedong Liu , Weiming Ren , Wei Fang
- Applicant Address: TW Hsinchu
- Assignee: Hermes-Microvision, Inc.
- Current Assignee: Hermes-Microvision, Inc.
- Current Assignee Address: TW Hsinchu
- Agency: Sawyer Law Group, P.C.
- Main IPC: G06K9/00
- IPC: G06K9/00

Abstract:
An apparatus comprises an imaging unit to image a wafer to be reviewed, wherein imaging unit is the modified SORIL column. The modified SORIL column includes a focusing sub-system to do micro-focusing due to a wafer surface topology, wherein the focusing sub-system verifies the position of a grating image reflecting from the wafer surface to adjust the focus; and a surface charge control to regulate the charge accumulation due to electron irradiation during the review process, wherein the gaseous molecules are injected under a flood gun beam rather than under a primary beam. The modified SORIL column further includes a storage unit for storing wafer design database; and a host computer to manage defect locating, defect sampling, and defect classifying, wherein the host computer and storage unit are linked by high speed network.
Public/Granted literature
- US20100150429A1 E-BEAM DEFECT REVIEW SYSTEM Public/Granted day:2010-06-17
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