发明授权
US08097509B2 Method for manufacturing semiconductor device with a recessed channel
有权
用于制造具有凹槽的半导体器件的方法
- 专利标题: Method for manufacturing semiconductor device with a recessed channel
- 专利标题(中): 用于制造具有凹槽的半导体器件的方法
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申请号: US12839075申请日: 2010-07-19
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公开(公告)号: US08097509B2公开(公告)日: 2012-01-17
- 发明人: Jin Yul Lee
- 申请人: Jin Yul Lee
- 申请人地址: KR Icheon-si
- 专利权人: Hynix Semiconductor Inc,
- 当前专利权人: Hynix Semiconductor Inc,
- 当前专利权人地址: KR Icheon-si
- 代理机构: Marshall, Gerstein & Borun LLP
- 优先权: KR10-2007-0127859 20071210
- 主分类号: H01L21/336
- IPC分类号: H01L21/336
摘要:
A semiconductor device having a recessed channel and a method for manufacturing the same. The semiconductor device comprises a semiconductor substrate formed with an isolation layer defining an active region including a channel region and a junction region, a recessed trench including a top trench formed within the channel region of the semiconductor substrate and a bottom trench formed from a bottom surface of the top trench with a width narrower than the top trench, and a gate stack overlapping the recessed trench and extending across the active region.
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