发明授权
US08097532B2 Method for manufacturing a semiconductor light emitting device 有权
半导体发光元件的制造方法

  • 专利标题: Method for manufacturing a semiconductor light emitting device
  • 专利标题(中): 半导体发光元件的制造方法
  • 申请号: US12086174
    申请日: 2006-12-04
  • 公开(公告)号: US08097532B2
    公开(公告)日: 2012-01-17
  • 发明人: Yukio Shakuda
  • 申请人: Yukio Shakuda
  • 申请人地址: JP Kyoto
  • 专利权人: Rohm Co., Ltd.
  • 当前专利权人: Rohm Co., Ltd.
  • 当前专利权人地址: JP Kyoto
  • 代理机构: Rabin & Berdo, P.C.
  • 优先权: JPP2005-355299 20051208
  • 国际申请: PCT/JP2006/324152 WO 20061204
  • 国际公布: WO2007/066605 WO 20070614
  • 主分类号: H01L21/28
  • IPC分类号: H01L21/28
Method for manufacturing a semiconductor light emitting device
摘要:
To provide a method for manufacturing a semiconductor light emitting device capable of providing sufficiently low operating voltage.The method for manufacturing a semiconductor light emitting device of the present invention includes: a semiconductor laminating step of laminating a plurality of nitride semiconductor layers of to form a semiconductor laminating structure; and an electrode forming step of forming n-side electrode and p-side electrodes on the n-type and p-type semiconductor layers. In the electrode forming step, after a first metallic layer including a Ni layer constituting a part of the n-side electrode is formed on a surface of a forming region of the n-side electrode, the first metallic layer is annealed in an atmosphere containing nitrogen and oxygen.
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