发明授权
- 专利标题: Method for manufacturing a semiconductor light emitting device
- 专利标题(中): 半导体发光元件的制造方法
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申请号: US12086174申请日: 2006-12-04
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公开(公告)号: US08097532B2公开(公告)日: 2012-01-17
- 发明人: Yukio Shakuda
- 申请人: Yukio Shakuda
- 申请人地址: JP Kyoto
- 专利权人: Rohm Co., Ltd.
- 当前专利权人: Rohm Co., Ltd.
- 当前专利权人地址: JP Kyoto
- 代理机构: Rabin & Berdo, P.C.
- 优先权: JPP2005-355299 20051208
- 国际申请: PCT/JP2006/324152 WO 20061204
- 国际公布: WO2007/066605 WO 20070614
- 主分类号: H01L21/28
- IPC分类号: H01L21/28
摘要:
To provide a method for manufacturing a semiconductor light emitting device capable of providing sufficiently low operating voltage.The method for manufacturing a semiconductor light emitting device of the present invention includes: a semiconductor laminating step of laminating a plurality of nitride semiconductor layers of to form a semiconductor laminating structure; and an electrode forming step of forming n-side electrode and p-side electrodes on the n-type and p-type semiconductor layers. In the electrode forming step, after a first metallic layer including a Ni layer constituting a part of the n-side electrode is formed on a surface of a forming region of the n-side electrode, the first metallic layer is annealed in an atmosphere containing nitrogen and oxygen.
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