发明授权
- 专利标题： Electronics device package and fabrication method thereof
- 专利标题（中）： 电子器件封装及其制造方法
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申请号： US12398946申请日： 2009-03-05
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公开(公告)号： US08097929B2公开(公告)日： 2012-01-17
- 发明人: Chia-Sheng Lin , Yu-Ting Huang , Chih-Lung Lai
- 申请人： Chia-Sheng Lin , Yu-Ting Huang , Chih-Lung Lai
- 主分类号： H01L23/52
- IPC分类号： H01L23/52
摘要：
Embodiments provide an electronic device package and a method for fabricating thereof. A semiconductor chip has a substrate. A supporting brick is separated from the substrate by a certain distance. A bonding pad having a surface is disposed across the substrate and the supporting brick.
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