发明授权
- 专利标题： Device mounting board, semiconductor module, and mobile device
- 专利标题（中）： 设备安装板，半导体模块和移动设备
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申请号： US12263174申请日： 2008-10-31
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公开(公告)号： US08097946B2公开(公告)日： 2012-01-17
- 发明人: Kouichi Saitou , Mayumi Nakasato , Ryosuke Usui
- 申请人： Kouichi Saitou , Mayumi Nakasato , Ryosuke Usui
- 申请人地址： JP Osaka
- 专利权人： Sanyo Electric Co., Ltd.
- 当前专利权人： Sanyo Electric Co., Ltd.
- 当前专利权人地址： JP Osaka
- 代理机构： McDermott Will & Emery LLP
- 优先权： JP2007-284470 20071031; JP2008-272393 20081022
- 主分类号： H01L23/053
- IPC分类号： H01L23/053 ; H01L23/12
摘要：
A device mounting board includes an insulating layer formed of an insulating resin, a glass cloth covering the surface of the insulating layer, and an electrode provided in a through hole extending through the glass cloth. The angle of contact with solder of the glass cloth is larger than that of the resin. Thus, solder bumps are formed on the electrode 14 of the device mounting board 10 with high precision.
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