A loudspeaker damper, a manufacturing method thereof, and a loudspeaker, electronic equipment and device using the loudspeaker damper. The damper has flexibility. Therefore, even if a large input is applied and the damper oscillates with a large amplitude, a resin layer provided on the surface of the damper base material is not cracked due to partial interface peeling. Thus, the damper follows such a large amplitude and realizes high input-resistance. This loudspeaker damper material is obtained by impregnating a material with thermosetting resin including 2 to 20 wt % of flexibility imparting agent and heat-curing thereof.