Invention Grant
- Patent Title: Evaporator, loop heat pipe module and heat generating apparatus
- Patent Title (中): 蒸发器,回路热管模块和发热装置
-
Application No.: US11831973Application Date: 2007-08-01
-
Publication No.: US08100170B2Publication Date: 2012-01-24
- Inventor: Bin-Juine Huang , Huan-Hsiang Huang , Fu-Sheng Sun , Yi-Hai Lian
- Applicant: Bin-Juine Huang , Huan-Hsiang Huang , Fu-Sheng Sun , Yi-Hai Lian
- Applicant Address: TW Taipei
- Assignee: Advanced Thermal Device Inc.
- Current Assignee: Advanced Thermal Device Inc.
- Current Assignee Address: TW Taipei
- Agency: Jianq Chyun IP Office
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
An evaporator suitable for absorbing heat from a heat source is provided. The evaporator includes a top board, a bottom board, a side frame, and at least one porous member. The side frame connects the top board and the bottom board. The porous member is disposed between the top board and the bottom board and within the side frame. The part of the top board covering the porous member is a heat conducting portion near the heat source. The evaporator has at least one first channel, at least one second channel, a fluid inlet, and a fluid outlet. The first channel is adjacent to the bottom board and the porous member for containing a working fluid. The second channel is adjacent to the top board and the porous member for containing the working fluid. The fluid inlet communicates with the first channel. The fluid outlet communicates with the second channel.
Public/Granted literature
- US20090032226A1 EVAPORATOR, LOOP HEAT PIPE MODULE AND HEAT GENERATING APPARATUS Public/Granted day:2009-02-05
Information query