Invention Grant
US08100317B2 Method of teaching eyepoints for wire bonding and related semiconductor processing operations
有权
教导用于引线键合和相关半导体加工操作的眼点的方法
- Patent Title: Method of teaching eyepoints for wire bonding and related semiconductor processing operations
- Patent Title (中): 教导用于引线键合和相关半导体加工操作的眼点的方法
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Application No.: US13072930Application Date: 2011-03-28
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Publication No.: US08100317B2Publication Date: 2012-01-24
- Inventor: Michael T. Deley , Peter M. Lister , Deepak Sood , Zhijie Wang
- Applicant: Michael T. Deley , Peter M. Lister , Deepak Sood , Zhijie Wang
- Applicant Address: US PA Fort Washington
- Assignee: Kulicke and Soffa Industries, Inc.
- Current Assignee: Kulicke and Soffa Industries, Inc.
- Current Assignee Address: US PA Fort Washington
- Agent Christopher M. Spletzer, Sr.
- Main IPC: B23K31/00
- IPC: B23K31/00 ; B23K11/00
Abstract:
A method of teaching an eyepoint for a wire bonding operation is provided. The method includes (1) selecting a group of shapes from a region of a semiconductor device for use as an eyepoint, and (2) teaching the eyepoint to a wire bonding machine using at least one of (a) a sample semiconductor device, or (b) predetermined data related to the semiconductor device. The teaching step includes defining locations of each of the shapes with respect to one another.
Public/Granted literature
- US20110174865A1 METHOD OF TEACHING EYEPOINTS FOR WIRE BONDING AND RELATED SEMICONDUCTOR PROCESSING OPERATIONS Public/Granted day:2011-07-21
Information query
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