发明授权
- 专利标题： Multilayer printed circuit board
- 专利标题（中）： 多层印刷电路板
-
申请号： US12135842申请日： 2008-06-09
-
公开(公告)号： US08101266B2公开(公告)日： 2012-01-24
- 发明人: Wen-Chin Lee , Cheng-Hsien Lin
- 申请人： Wen-Chin Lee , Cheng-Hsien Lin
- 申请人地址： TW Tayuan, Taoyuan
- 专利权人： Zhen Ding Technology Co., Ltd.
- 当前专利权人： Zhen Ding Technology Co., Ltd.
- 当前专利权人地址： TW Tayuan, Taoyuan
- 代理机构： Altis Law Group, Inc.
- 优先权： CN200710202336 20071031
- 主分类号： H01K1/00
- IPC分类号： H01K1/00
摘要：
A multilayer printed circuit board includes a first printed circuit board, a second printed circuit board, an adhesive film, and a function layer. The adhesive film is sandwiched between the first printed circuit board and the second printed circuit board. The function layer is disposed between the first printed circuit board and the second printed circuit board for blocking water from passing therethrough and for screening electromagnetic interference between the first printed circuit board and the second printed circuit board.
公开/授权文献
- US20090107706A1 MULTILAYER PRINTED CIRCUIT BOARD 公开/授权日：2009-04-30
信息查询
