发明授权
- 专利标题： Integrated circuit package system
- 专利标题（中）： 集成电路封装系统
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申请号： US12194506申请日： 2008-08-19
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公开(公告)号： US08102666B2公开(公告)日： 2012-01-24
- 发明人: HyungSang Park , In Sang Yoon , DeokKyung Yang , Soo-San Park
- 申请人： HyungSang Park , In Sang Yoon , DeokKyung Yang , Soo-San Park
- 申请人地址： SG Singapore
- 专利权人： Stats Chippac Ltd.
- 当前专利权人： Stats Chippac Ltd.
- 当前专利权人地址： SG Singapore
- 代理商 Mikio Ishimaru
- 主分类号： H01L23/02
- IPC分类号： H01L23/02
摘要：
An integrated circuit package system includes: connecting a carrier and an integrated circuit mounted thereover; mounting an interposer, having an opening, over the integrated circuit; connecting an interconnect between the interposer and the carrier through the opening; and forming an encapsulation planar with a carrier vertical side of the carrier and an interposer vertical side of the interposer.
公开/授权文献
- US20100046183A1 INTEGRATED CIRCUIT PACKAGE SYSTEM 公开/授权日：2010-02-25
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