发明授权
US08104666B1 Thermal compressive bonding with separate die-attach and reflow processes
有权
具有独立的芯片附着和回流工艺的热压接
- 专利标题： Thermal compressive bonding with separate die-attach and reflow processes
- 专利标题（中）： 具有独立的芯片附着和回流工艺的热压接
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申请号： US12874009申请日： 2010-09-01
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公开(公告)号： US08104666B1公开(公告)日： 2012-01-31
- 发明人: Chien Ling Hwang , Ying-Jui Huang , Cheng-Chung Lin , Chung-Shi Liu
- 申请人： Chien Ling Hwang , Ying-Jui Huang , Cheng-Chung Lin , Chung-Shi Liu
- 申请人地址： TW Hsin-Chu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsin-Chu
- 代理机构： Slater & Matsil, L.L.P.
- 主分类号： B23K31/02
- IPC分类号： B23K31/02
摘要：
A method of bonding includes providing a first work piece, and attaching a second work piece on the first work piece, with a solder bump disposed between the first and the second work pieces. The second work piece is heated using a heating head of a heating tool to melt the solder bump. After the step of heating the second work piece, one of the first and the second work pieces is allowed to move freely in a horizontal direction to self-align the first and the second work pieces. After the step of allowing one of the first and the second work pieces to move, a temperature of the heating head is lowed until the first solder bump solidifies to form a second solder bump.