Invention Grant
- Patent Title: Compression mold and molding process
- Patent Title (中): 压模和成型工艺
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Application No.: US12290339Application Date: 2008-10-29
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Publication No.: US08105522B2Publication Date: 2012-01-31
- Inventor: Alex Lee Walls , David Keith Gill
- Applicant: Alex Lee Walls , David Keith Gill
- Applicant Address: US OH Cleveland
- Assignee: Eaton Corporation
- Current Assignee: Eaton Corporation
- Current Assignee Address: US OH Cleveland
- Agent Daniel S. Kalka
- Main IPC: B29C63/00
- IPC: B29C63/00

Abstract:
An improved compression molding process uses a separation plate 26 disposed between the upper and lower sections 22, 24 of a compression mold 20 for forming a grip with a distinct separation of multiple elastomeric materials. An optional compound retention plate 25 mounted on at least one of the mold sections forms a distinct color separation in the resulting grip. The optional compound retention plate 25 provides at least one groove formed in the split line of the grip that may be filled in with paint for a distinct overall two color appearance.
Public/Granted literature
- US20100102479A1 Compression mold and molding process Public/Granted day:2010-04-29
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