Invention Grant
- Patent Title: Insert-molded product having porous member
- Patent Title (中): 具有多孔构件的嵌入成型制品
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Application No.: US11824997Application Date: 2007-07-02
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Publication No.: US08105669B2Publication Date: 2012-01-31
- Inventor: Kazuhiro Asao
- Applicant: Kazuhiro Asao
- Applicant Address: JP
- Assignee: Sumitomo Wiring Systems, Ltd.
- Current Assignee: Sumitomo Wiring Systems, Ltd.
- Current Assignee Address: JP
- Agent Gerald E. Hespos; Michael J. Porco
- Priority: JP2006-188279 20060707
- Main IPC: B32B1/08
- IPC: B32B1/08 ; B32B33/00

Abstract:
In forming a molded member (30) by insert molding, a porous member (10) and a cylindrical member (20) fitted on a peripheral edge of the porous member (10) are set in a die (40); and the molded member (30) is formed with the molded member (30) out of contact with the porous member (10) and with the molded member (30) in close contact with an outer surface of the cylindrical member (20) by the insert molding. Therefore a landed position (first landed surface (45A), second landed surface (45B)) of the die (40) is set on the outer surface of the cylindrical member (20). Thus there is no fear that liquid resin penetrates into the pores of the porous member (10) in the insert molding. Thereby by the insert molding, it is possible to form the molded member (30) holding the porous member (10).
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