发明授权
US08105749B2 Polymer compound, positive resist composition, and method of forming resist pattern
有权
高分子化合物,正性抗蚀剂组合物和形成抗蚀剂图案的方法
- 专利标题: Polymer compound, positive resist composition, and method of forming resist pattern
- 专利标题(中): 高分子化合物,正性抗蚀剂组合物和形成抗蚀剂图案的方法
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申请号: US12814356申请日: 2010-06-11
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公开(公告)号: US08105749B2公开(公告)日: 2012-01-31
- 发明人: Takahiro Dazai , Takayoshi Mori , Hiroaki Shimizu , Kyoko Ohshita
- 申请人: Takahiro Dazai , Takayoshi Mori , Hiroaki Shimizu , Kyoko Ohshita
- 申请人地址: JP Kawasaki-shi
- 专利权人: Tokyo Ohka Kogyo Co., Ltd.
- 当前专利权人: Tokyo Ohka Kogyo Co., Ltd.
- 当前专利权人地址: JP Kawasaki-shi
- 代理机构: Knobbe Martens Olson & Bear LLP
- 优先权: JP2007-233247 20070907
- 主分类号: G03F7/004
- IPC分类号: G03F7/004 ; G03F7/30 ; C08F28/06
摘要:
There is provided a positive resist composition including a resin component (A) which displays increased solubility in an alkali developing solution under action of acid, and an acid generator component (B) which generates an acid upon exposure, wherein the resin component (A) includes a polymer compound (A1) containing a structural unit (a0) represented by a general formula (a0-1) shown below, and a structural unit (a1) derived from an acrylate ester which has an acid dissociable, dissolution inhibiting group: (in the formula (a0-1), R represents a hydrogen atom, a lower alkyl group, or a halogenated lower alkyl group; two of R′ each independently represents a hydrogen atom, a lower alkyl group, or an alkoxy group of 1 to 5 carbon atoms; X represents an alkylene group of 1 to 5 carbon atoms, an oxygen atom, or a sulfur atom.).
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