发明授权
US08105763B2 Method of forming plated product using negative photoresist composition and photosensitive composition used therein
有权
使用负光致抗蚀剂组合物和其中使用的光敏组合物形成电镀产品的方法
- 专利标题： Method of forming plated product using negative photoresist composition and photosensitive composition used therein
- 专利标题（中）： 使用负光致抗蚀剂组合物和其中使用的光敏组合物形成电镀产品的方法
-
申请号： US11629017申请日： 2005-05-10
-
公开(公告)号： US08105763B2公开(公告)日： 2012-01-31
- 发明人: Yasuo Masuda , Yasushi Washio , Koji Saito
- 申请人： Yasuo Masuda , Yasushi Washio , Koji Saito
- 申请人地址： JP Kawasaki-shi
- 专利权人： Tokyo Ohka Kogyo Co., Ltd.
- 当前专利权人： Tokyo Ohka Kogyo Co., Ltd.
- 当前专利权人地址： JP Kawasaki-shi
- 代理机构： Knobbe Martens Olson & Bear LLP
- 优先权： JPP2004-195034 20040630
- 国际申请： PCT/JP2005/008846 WO 20050510
- 国际公布： WO2006/003757 WO 20060112
- 主分类号： G03F5/00
- IPC分类号： G03F5/00
摘要：
A method is provided that enables the formation of multiple level plated products with large plating depth. A negative photoresist composition comprising (a) an alkali-soluble resin, (b) an acid generator, and (c) other components is used, and a plated product is formed by (A) a step of forming a layer of this negative photoresist composition, and then either heating or not heating, before conducting exposure; (B) a step of repeating the step (A) so that the step is performed a total of 2 or more times, thereby superimposing layers of the negative photoresist, and subsequently developing all of these layers simultaneously to form a multilayer resist pattern; and (C) a step of conducting plating treatment within this multilayer resist pattern.
公开/授权文献
信息查询
