Invention Grant
US08105824B2 Integrated chip carriers with thermocycler interfaces and methods of using the same
有权
具有热循环器接口的集成芯片载体及其使用方法
- Patent Title: Integrated chip carriers with thermocycler interfaces and methods of using the same
- Patent Title (中): 具有热循环器接口的集成芯片载体及其使用方法
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Application No.: US12987787Application Date: 2011-01-10
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Publication No.: US08105824B2Publication Date: 2012-01-31
- Inventor: Geoffrey Facer , Robert Grossman , Marc Unger , Phillip Lam , Hou-Pu Chou , Jake Kimball , Martin Pieprzyk , Antoine Daridon
- Applicant: Geoffrey Facer , Robert Grossman , Marc Unger , Phillip Lam , Hou-Pu Chou , Jake Kimball , Martin Pieprzyk , Antoine Daridon
- Applicant Address: US CA South San Francisco
- Assignee: Fluidigm Corporation
- Current Assignee: Fluidigm Corporation
- Current Assignee Address: US CA South San Francisco
- Agency: Kilpatrick Townsend & Stockton LLP
- Main IPC: C12M1/00
- IPC: C12M1/00 ; C12M3/00

Abstract:
Methods and systems are provided for conducting a reaction at a selected temperature or range of temperatures over time. An array device is provided. The array device contains separate reaction chambers and is formed as an elastomeric block from multiple layers. At least one layer has at least one recess that recess has at least one deflectable membrane integral to the layer with the recess. The array device has a thermal transfer device proximal to at least one of the reaction chambers. The thermal transfer device is formed to contact a thermal control source. Reagents for carrying out a desired reaction are introduced into the array device. The array device is contacted with a thermal control device such that the thermal control device is in thermal communication with the thermal control source so that a temperature of the reaction in at least one of the reaction chamber is changed as a result of a change in temperature of the thermal control source.
Public/Granted literature
- US20110265304A1 INTEGRATED CHIP CARRIERS WITH THERMOCYCLER INTERFACES AND METHODS OF USING THE SAME Public/Granted day:2011-11-03
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