发明授权
- 专利标题: Manufacturing method of semiconductor memory device
- 专利标题(中): 半导体存储器件的制造方法
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申请号: US12696695申请日: 2010-01-29
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公开(公告)号: US08105907B2公开(公告)日: 2012-01-31
- 发明人: Eiji Hasunuma , Shigeru Shiratake , Takeshi Ohgami
- 申请人: Eiji Hasunuma , Shigeru Shiratake , Takeshi Ohgami
- 申请人地址: JP Tokyo
- 专利权人: Elpida Memory, Inc.
- 当前专利权人: Elpida Memory, Inc.
- 当前专利权人地址: JP Tokyo
- 代理机构: Sughrue Mion, PLLC
- 优先权: JP2009-019787 20090130
- 主分类号: H01L21/336
- IPC分类号: H01L21/336
摘要:
To provide a manufacturing method of a semiconductor memory device, the method including forming contact plugs to be connected to a drain region or a source region of each of transistors, by using a SAC line technique of selectively etching an insulation layer that covers each of the transistors by using a mask having a line-shaped opening provided across the contact plugs. Each of the transistors constituting a sense amplifier that amplifies a potential difference between bit lines is a ring-gate transistor.
公开/授权文献
- US20100197097A1 MANUFACTURING METHOD OF SEMICONDUCTOR MEMORY DEVICE 公开/授权日:2010-08-05
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