发明授权
- 专利标题： Integrated circuit system with carbon and non-carbon silicon
- 专利标题（中）： 具有碳和非碳硅的集成电路系统
-
申请号： US11464664申请日： 2006-08-15
-
公开(公告)号： US08105955B2公开(公告)日： 2012-01-31
- 发明人: Jin Ping Liu , Richard J. Murphy , Anita Madan , Ashima B. Chakravarti
- 申请人： Jin Ping Liu , Richard J. Murphy , Anita Madan , Ashima B. Chakravarti
- 申请人地址： SG Singapore US NY Armonk
- 专利权人： GLOBALFOUNDRIES Singapore Pte. Ltd.,International Business Machines Corporation
- 当前专利权人： GLOBALFOUNDRIES Singapore Pte. Ltd.,International Business Machines Corporation
- 当前专利权人地址： SG Singapore US NY Armonk
- 代理商 Mikio Ishimaru
- 主分类号： H01L21/31
- IPC分类号： H01L21/31
摘要：
An integrated circuit system includes a substrate, a carbon-containing silicon region over the substrate, a non-carbon-containing silicon region over the substrate, and a silicon-carbon region, including the non-carbon-containing silicon region and the carbon-containing silicon region.