Invention Grant
- Patent Title: Optical semiconductor device with flexible substrate
- Patent Title (中): 具有柔性基板的光学半导体器件
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Application No.: US12484196Application Date: 2009-06-13
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Publication No.: US08106408B2Publication Date: 2012-01-31
- Inventor: Takuma Ban , Michihide Sasada , Masanobu Okayasu
- Applicant: Takuma Ban , Michihide Sasada , Masanobu Okayasu
- Applicant Address: JP Yokohama-shi
- Assignee: Opnext Japan, Inc.
- Current Assignee: Opnext Japan, Inc.
- Current Assignee Address: JP Yokohama-shi
- Agency: Miles & Stockbridge P.C.
- Priority: JP2008-157602 20080617
- Main IPC: H01L31/12
- IPC: H01L31/12

Abstract:
A metal pattern for a high frequency signal is patterned on a flexile substrate, and the flexile substrate is bent in such a way as to form a substantially right angle at a spot corresponding to an end of the metal pattern for the signal. And an end of the metal pattern is fixedly attached to a lead pin for signaling, attached to a stem, for electrical continuity, so as to be in a posture horizontal with each other. Meanwhile, a part of the lead pins attached to the stem, being in such a state as penetrated through respective holes provided in the flexible substrate, is fixedly attached to a part of metal patterns provided on the flexible substrate so as to ensure electrical continuity therebetween.
Public/Granted literature
- US20100006863A1 OPTICAL SEMICONDUCTOR DEVICE Public/Granted day:2010-01-14
Information query
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