Invention Grant
US08106459B2 FinFETs having dielectric punch-through stoppers 有权
FinFET具有绝缘穿孔塞

FinFETs having dielectric punch-through stoppers
Abstract:
A semiconductor structure includes a semiconductor substrate; a planar transistor on a first portion of the semiconductor substrate, wherein the first portion of the semiconductor substrate has a first top surface; and a multiple-gate transistor on a second portion of the semiconductor substrate. The second portion of the semiconductor substrate is recessed from the first top surface to form a fin of the multiple-gate transistor. The fin is electrically isolated from the semiconductor substrate by an insulator.
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