Invention Grant
- Patent Title: FinFETs having dielectric punch-through stoppers
- Patent Title (中): FinFET具有绝缘穿孔塞
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Application No.: US12116074Application Date: 2008-05-06
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Publication No.: US08106459B2Publication Date: 2012-01-31
- Inventor: Cheng-Hung Chang , Chen-Hua Yu , Chen-Nan Yeh
- Applicant: Cheng-Hung Chang , Chen-Hua Yu , Chen-Nan Yeh
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
A semiconductor structure includes a semiconductor substrate; a planar transistor on a first portion of the semiconductor substrate, wherein the first portion of the semiconductor substrate has a first top surface; and a multiple-gate transistor on a second portion of the semiconductor substrate. The second portion of the semiconductor substrate is recessed from the first top surface to form a fin of the multiple-gate transistor. The fin is electrically isolated from the semiconductor substrate by an insulator.
Public/Granted literature
- US20090278196A1 FinFETs having dielectric punch-through stoppers Public/Granted day:2009-11-12
Information query
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