Invention Grant
US08106494B2 Leadframe for leadless package, structure and manufacturing method using the same
有权
无引线封装的引线框架，结构和制造方法使用相同
- Patent Title: Leadframe for leadless package, structure and manufacturing method using the same
- Patent Title (中): 无引线封装的引线框架，结构和制造方法使用相同
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Application No.: US13016341Application Date: 2011-01-28
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Publication No.: US08106494B2Publication Date: 2012-01-31
- Inventor: Chun Ying Lin , Geng Shin Shen , Yu Tang Pan , Shih Wen Chou
- Applicant: Chun Ying Lin , Geng Shin Shen , Yu Tang Pan , Shih Wen Chou
- Applicant Address: TW Hsinchu
- Assignee: Chipmos Technologies Inc.
- Current Assignee: Chipmos Technologies Inc.
- Current Assignee Address: TW Hsinchu
- Agency: WPAT, P.C.
- Agent Anthony King
- Priority: TW96113893A 20070420
- Main IPC: H01L23/495
- IPC: H01L23/495
Abstract:
A leadframe employed by a leadless package comprises a plurality of package units and an adhesive tape. Each of the package units has a die pad with a plurality of openings and a plurality of pins disposed in the plurality of openings. The adhesive tape is adhered to the surfaces of the plurality of package units and fixes the die pad and the plurality of pins.
Public/Granted literature
- US20110133322A1 LEADFRAME FOR LEADLESS PACKAGE, STRUCTURE AND MANUFACTURING METHOD USING THE SAME Public/Granted day:2011-06-09
Information query
IPC分类:
