- 专利标题： Connecting and bonding adjacent layers with nanostructures
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申请号： US12210091申请日： 2008-09-12
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公开(公告)号： US08106517B2公开(公告)日： 2012-01-31
- 发明人: Mohammad Shafiqul Kabir , Andrzej Brud
- 申请人： Mohammad Shafiqul Kabir , Andrzej Brud
- 专利权人： Smoltek AB
- 当前专利权人： Smoltek AB
- 代理机构： Fish & Richardson P.C.
- 主分类号： H01L29/40
- IPC分类号： H01L29/40 ; H01L21/44
摘要：
An apparatus, comprising two conductive surfaces or layers and a nanostructure assembly bonded to the two conductive surfaces or layers to create electrical or thermal connections between the two conductive surfaces or layers, and a method of making same.
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