Invention Grant
- Patent Title: Signal delivery in stacked device
- Patent Title (中): 堆叠设备中的信号传送
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Application No.: US12209052Application Date: 2008-09-11
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Publication No.: US08106520B2Publication Date: 2012-01-31
- Inventor: Brent Keeth , Mark Hiatt , Terry R. Lee , Mark Tuttle , Rahul Advani , John F. Schreck
- Applicant: Brent Keeth , Mark Hiatt , Terry R. Lee , Mark Tuttle , Rahul Advani , John F. Schreck
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Schwegman, Lundberg & Woessner, P.A.
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40
Abstract:
Some embodiments include apparatus, systems, and methods having a base, a first die, a second arranged in a stacked with the first die and the base, and a structure located in the stack and outside at least one of the first and second dice and configured to transfer signals between the base and at least one of the first and second dice.
Public/Granted literature
- US20100059898A1 SIGNAL DELIVERY IN STACKED DEVICE Public/Granted day:2010-03-11
Information query
IPC分类:
