Invention Grant
- Patent Title: Ink ejecting device and method of manufacturing the same
- Patent Title (中): 喷墨装置及其制造方法
-
Application No.: US12416954Application Date: 2009-04-02
-
Publication No.: US08109609B2Publication Date: 2012-02-07
- Inventor: Dong-Sik Shim , Yong-Seop Yoon , Bang-Weon Lee , Moon-Chul Lee , Yong-Won Jeong , Jong-Seok Kim
- Applicant: Dong-Sik Shim , Yong-Seop Yoon , Bang-Weon Lee , Moon-Chul Lee , Yong-Won Jeong , Jong-Seok Kim
- Applicant Address: KR Suwon-Si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-Si
- Agency: Staas & Halsey LLP
- Priority: KR10-2008-0086801 20080903
- Main IPC: B41J2/14
- IPC: B41J2/14

Abstract:
Disclosed are an ink ejecting device and a method of manufacturing the same. The disclosed ink ejecting device includes an inkjet head including a substrate, which includes an ink feed hole, a plurality of via holes, which are formed in the rear surface of the substrate, and which expose the ink feed holes therethtough, a chamber layer stacked on the substrate, and a nozzle layer stacked on the chamber layer, and includes a base header, which is attached to the inkjet head and includes a plurality of ink supply slots having a corresponding arrangement with respect to the via holes.
Public/Granted literature
- US20100053272A1 INK EJECTING DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2010-03-04
Information query
IPC分类: