Invention Grant
- Patent Title: Method to form a recess for a microfluidic device
- Patent Title (中): 形成微流体装置的凹部的方法
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Application No.: US12422732Application Date: 2009-04-13
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Publication No.: US08110117B2Publication Date: 2012-02-07
- Inventor: Fuchao Wang , Ming Fang
- Applicant: Fuchao Wang , Ming Fang
- Applicant Address: US TX Coppell
- Assignee: STMicroelectronics, Inc.
- Current Assignee: STMicroelectronics, Inc.
- Current Assignee Address: US TX Coppell
- Agency: Seed IP Law Group PLLC
- Agent Lisa K. Jorgenson; Hayley J. Stevens
- Main IPC: B44C1/22
- IPC: B44C1/22

Abstract:
A method includes forming a recess in a first surface of a substrate, the recess having a width, depth, and height selected to correspond to a width, depth, and height of a fluid chamber, forming a sacrificial material in the recess, forming a first heater element, forming a metal layer overlying the first heater element, and forming a nozzle opening in the metal layer to expose the sacrificial material. The method also includes forming a path from a second surface of the substrate to expose the sacrificial material and removing the sacrificial material from the recess to expose the chamber with the selected width, depth, and height, the chamber in fluid communication with the path, the nozzle opening, and a surrounding environment.
Public/Granted literature
- US20100163517A1 METHOD TO FORM A RECESS FOR A MICROFLUIDIC DEVICE Public/Granted day:2010-07-01
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